Improving stamps for 10 nm level wafer scale nanoimprint lithography

被引:236
作者
Beck, M
Graczyk, M
Maximov, I
Sarwe, EL
Ling, TGI
Keil, M
Montelius, L
机构
[1] Lund Univ, Div Solid State Phys, S-22100 Lund, Sweden
[2] Obducat AB, S-20125 Malmo, Sweden
[3] Lund Univ, Nanometer Consortium, S-22100 Lund, Sweden
关键词
nanoimprint lithography; anti-adhesion; fluorosilane; stamp;
D O I
10.1016/S0167-9317(02)00464-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The smaller the features on the stamp the more important are the interactions between stamp and polymer layer. A stamp rich in small structures will effectively show a surface area enlargement, which generally leads to adhesion of the polymer to the stamp. This makes a subsequent imprint impossible without troublesome and time-consuming cleaning. The anti-adhesion properties of Si- or SiO2-based stamps can be improved by binding fluorinated silanes covalently to the surface. In this paper, we demonstrate that the deposition procedure as well as the environment during deposition are important with respect to the quality and performance of the molecular layer. (C) 2002 Published by Elsevier Science B.V.
引用
收藏
页码:441 / 448
页数:8
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