Ink-jet fabrication of polymer microlens for optical-I/O chip packaging

被引:55
作者
Ishii, Y [1 ]
Koike, S [1 ]
Arai, Y [1 ]
Ando, Y [1 ]
机构
[1] Nippon Telegraph & Tel Corp, Telecommun Energy Labs, Musashino, Tokyo 1808585, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2000年 / 39卷 / 3B期
关键词
optical interconnections; microlens; ink-jet; VCSEL; UV-curable epoxy resin; integration; packaging;
D O I
10.1143/JJAP.39.1490
中图分类号
O59 [应用物理学];
学科分类号
摘要
We report on a simple and versatile method of fabricating polymer microlenses that can be easily integrated with optical devices. UV-curable epoxy resin is dropped onto optical devices by an ink-jet apparatus. When the droplets touch the surface, they form into partial spheres due to their surface tension. UV light irradiation for less than five minutes call easily turn them into solid microlenses. Various microlenses, having a geometrical diameter from 20 to 140 mu m with F/1.0 to F/11.0, were successfully produced by controlling the volume and viscosity of the polymer resin and their wettability to the substrate. Their uniformity in a microlens array was measured to be within +/-1% in diameter and +/-3 mu m in pitch. Hybrid integration of an ink-jetted microlens with a wire-bonded vertical-cavity surface-emitting laser (VCSEL) was also demonstrated. When an ink-jetted microlens (45-mu m diameter, F/2.0) was formed on the aperture of an 850-nm VCSEL, the coupling efficiency into a single-mode fiber was 4 dB higher than without the microlens.
引用
收藏
页码:1490 / 1493
页数:4
相关论文
共 19 条
[1]  
ANDO Y, 1997, P IEEE LAS EL SOC 19, V1, P126
[2]   MICROLENS ARRAYS PRODUCED BY A PHOTOLYTIC TECHNIQUE [J].
BORRELLI, NF ;
MORSE, DL .
APPLIED OPTICS, 1988, 27 (03) :476-479
[3]   The Jitney parallel optical interconnect [J].
Crow, JD ;
Choi, JH ;
Cohen, MS ;
Johnson, G ;
Kuchta, D ;
Lacey, D ;
Ponnapalli, S ;
Pepeljugoski, P ;
Stawiasz, K ;
Trewhella, J ;
Xiao, P ;
Tremblay, S ;
Ouimet, S ;
Lacerte, A ;
Gauvin, M ;
Booth, D ;
Nation, W ;
Smith, TL ;
DeBaun, BA ;
Henson, GD ;
Igl, SA ;
Lee, NA ;
Piekarczyk, AJ ;
Kuczma, AS ;
Spanoudis, SL .
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, :292-300
[4]   Packaging of VCSEL arrays for cost-effective interconnects at <10 meters [J].
Hibbs-Brenner, M ;
Lehman, J ;
Liu, Y ;
Johnson, K ;
Morgan, R ;
Strzelecka, E ;
Skogman, R .
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, :747-752
[5]   2-DIMENSIONAL ARRAY OF DIFFRACTIVE MICROLENSES FABRICATED BY THIN-FILM DEPOSITION [J].
JAHNS, J ;
WALKER, SJ .
APPLIED OPTICS, 1990, 29 (07) :931-936
[6]   Parallel optical link (PAROLI) for multichannel gigabit rate interconnections [J].
Karstensen, H ;
Melchior, L ;
Plickert, V ;
Drogemuller, K ;
Blank, J ;
Wipiejewski, T ;
Wolf, HD ;
Wieland, J ;
Jeiter, G ;
Dal'Ara, R ;
Blaser, M .
48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, :747-754
[7]   A 100-Gb/s throughput ATM switch MCM with a 320-channel parallel optical I/O interface [J].
Kawano, R ;
Yamanaka, N ;
Oki, E ;
Yasukawa, S ;
Okazaki, K ;
Ohki, A ;
Usui, M ;
Sato, N ;
Katsura, K ;
Ando, Y ;
Kagawa, T ;
Hikita, M .
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, :753-758
[8]   MICROLENS ARRAYS FOR INTERCONNECTION OF SINGLEMODE FIBER ARRAYS [J].
LEGGATT, JS ;
HUTLEY, MC .
ELECTRONICS LETTERS, 1991, 27 (03) :238-240
[9]  
MILLER DAB, 1996, J PARALLEL DISTRIBUT
[10]  
MIURA A, 1996, P 46 EL COMP TECHN C, P225