On-chip actuation of an in-plane compliant bistable micromechanism

被引:59
作者
Baker, MS [1 ]
Howell, LL [1 ]
机构
[1] Brigham Young Univ, Dept Mech Engn, Provo, UT 84602 USA
基金
美国国家科学基金会;
关键词
bistable; compliant mechanism; micro relay; micro switch; pseudo-rigid-body model; thermal actuator;
D O I
10.1109/JMEMS.2002.803284
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A compliant bistable micromechanism has been developed which can be switched in either direction using on-chip thermal actuation. The energy storage and bistable behavior of the mechanism is achieved through the elastic deflection of compliant segments. The Pseudo-Rigid-Body Model was used for the compliant mechanism design, and for analysis of the large deflection flexible segments. To achieve on-chip actuation, the mechanism design was optimized to allow it to be switched using linear motion thermal actuators. The modeling theory and analysis are presented for three design iterations, with two iterations fabricated in the MUMP's process and the third in the SUMMiT process.
引用
收藏
页码:566 / 573
页数:8
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