Transient pressure induced by laser ablation of liquid toluene: toward the understanding of laser-induced backside wet etching

被引：40

作者：

Kawaguchi, Y ^{[1
]}

Ding, X ^{[1
]}

Narazaki, A ^{[1
]}

Sato, T ^{[1
]}

Niino, H ^{[1
]}

机构：

[1] Natl Inst Adv Ind Sci & Technol, Photoreact Control Res Ctr, Tsukuba, Ibaraki 3058565, Japan

来源：

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2004年 / 79卷 / 4-6期

关键词：

D O I：

10.1007/s00339-004-2580-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

To clarify the initial stage of laser-induced backside wet etching, we directly measured transient pressure upon laser ablation of toluene under KrF excimer laser irradiation by using a fast-response pressure gauge. The propagation time of the pressure peak to the gauge agreed well with the time for the shock wave to reach the gauge on time-resolved images. The peak pressure P decreased slowly with increasing distance d: P=30.4 MPa for d=100 mum to P=11.1 MPa for d=1000 mum at a fluence F=1.0 J cm(-2) pulse(-1). The initial pressure, estimated to be of the order of 10-200 MPa, impinges on a transparent plate and contributes to the etching.

引用

页码：883 / 885

页数：3

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