Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry

被引:86
作者
Evoy, S
DiLello, N
Deshpande, V
Narayanan, A
Liu, H
Riegelman, M
Martin, BR
Hailer, B
Bradley, JC
Weiss, W
Mayer, TS
Gogotsi, Y
Bau, HH
Mallouk, TE
Raman, S
机构
[1] Univ Penn, Dept Elect & Syst Engn, Philadelphia, PA 19104 USA
[2] Virginia Polytech Inst & State Univ, Bradley Dept Elect & Comp Engn, Blacksburg, VA 24061 USA
[3] Univ Penn, Dept Mech Engn & Appl Mech, Philadelphia, PA 19104 USA
[4] Penn State Univ, Dept Chem, University Pk, PA 16802 USA
[5] Virginia Polytech Inst & State Univ, Dept Mat Sci & Engn, Blacksburg, VA 24061 USA
[6] Drexel Univ, Dept Chem, Philadelphia, PA 19104 USA
[7] Penn State Univ, Dept Elect Engn, University Pk, PA 16802 USA
[8] Drexel Univ, Dept Mat Sci & Engn, Philadelphia, PA 19104 USA
关键词
sensors; nanometer structures; integrated systems; dielectrophoresis; nano-assembly;
D O I
10.1016/j.mee.2003.09.010
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a novel platform for the development and deployment of nanosensors in integrated systems. The nanosensor technology is based on "striped" high aspect ratio cylindrical structures grown using porous membranes as templates. These nanostructures are manipulated using dielectrophoretic forces, allowing their individual assembly and characterization. This assembly also enables the development of "mixed-mode" integrated circuits that include readout, signal processing, and communications circuitry, as well as the requisite layout for the post-IC assembly of the nanostructures. We report on preliminary designs of such mixed mode systems whose layouts integrate dielectrophoretic assembly sites with a rudimentary resistance read-out circuitry. (C) 2004 Published by Elsevier B.V.
引用
收藏
页码:31 / 42
页数:12
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