Microstructure and Electrochemical Properties of PVD TiN, (Ti, Al) N-Coated Ti-Based Bulk Metallic Glasses

被引:12
作者
Qin, F. X. [1 ]
Xie, G. Q. [1 ]
Wang, X. M. [1 ]
Wada, T. [1 ]
Song, M. [2 ]
Furuya, K. [2 ]
Yoshimura, M. [1 ]
Tsukamoto, M. [3 ]
Inoue, A. [1 ]
机构
[1] Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan
[2] Natl Inst Mat Sci, Tsukuba, Ibaraki 3050003, Japan
[3] Osaka Univ, Joining & Welding Res Inst, Ibaraki 5670047, Japan
关键词
bulk metallic glass; physical vapor deposition (PVD) coating; microstructure; corrosion resistance; CORROSION BEHAVIOR; HARD COATINGS; SINGLE-LAYER; PERFORMANCE; TITANIUM; ALLOY; DEPOSITION; NITRIDE; FILMS;
D O I
10.2320/matertrans.ME200820
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study, the microstructure and electrochemical properties of PVD TiN and (Ti, Al) N coatings on Ti40Zr10Cu36Pd14 bulk metallic glass were investigated. The microstructure of TiN or (Ti, AI) N coatings, the BMG substrate and the interface was investigated by high-resolution transmission electron microscopy. The electrochemical behavior of PVD coatings on the Ti-based BMG was studied by measuring potentiodynamic polarization curves in Hanks' solution. HREM observation revealed that the sputtering TiN ((Ti, AI) N) coating consisted of cubic TiN ((Ti, Al) N) phase with a lattice parameter of 0.426 (0.422) nm in nanoscale. The polarization curves showed that the open circuit potential shifted to a more positive potential and the passive current density decreased due to the protective TiN or (Ti, AI) N coating. [doi:10.2320/matertrans.ME200820]
引用
收藏
页码:1313 / 1317
页数:5
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