A small area in-situ MEMS test structure to measure fracture strength by electrostatic probing

被引：15

作者：

de Boer, MP ^{[1
]}

Jensen, BD ^{[1
]}

Bitsie, F ^{[1
]}

机构：

[1] Sandia Natl Labs, Dept 1725, Albuquerque, NM 87185 USA

来源：

MATERIALS AND DEVICE CHARACTERIZATION IN MICROMACHINING II | 1999年 / 3875卷

关键词：

D O I：

10.1117/12.360459

中图分类号：

TU [建筑科学];

学科分类号：

0813 ;

摘要：

We have designed, fabricated, tested and modeled a first generation small area test structure for MEMS fracture studies by electrostatic rather than mechanical probing. Because of its small area, this device has potential applications as a lot monitor of strength or fatigue of the MEMS structural material. By matching deflection versus applied voltage data to a 3-D model of the test structure, we develop high confidence that the local stresses achieved in the gage section are greater than 1 GPa. Brittle failure of the polycrystalline silicon was observed.

引用

页码：97 / 103

页数：7

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