Photo-induced decomposition of platinum metalorganic films for electroless copper plating

被引:21
作者
Zhang, JY
Boyd, IW
机构
[1] Dept. of Electron. and Elec. Eng., University College London, London WC1E 7JE, Torrington Place
基金
英国工程与自然科学研究理事会;
关键词
D O I
10.1023/A:1018593701154
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
[No abstract available]
引用
收藏
页码:996 / 998
页数:3
相关论文
共 16 条
[1]   PHOTOCHEMICALLY GENERATED GOLD CATALYST FOR SELECTIVE ELECTROLESS PLATING OF COPPER [J].
BAUM, TH .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (01) :252-255
[2]   LASER-INDUCED SELECTIVE COPPER DEPOSITION ON POLYIMIDE [J].
COLE, HS ;
LIU, YS ;
ROSE, JW ;
GUIDA, R .
APPLIED PHYSICS LETTERS, 1988, 53 (21) :2111-2113
[3]   INVESTIGATION OF THE MECHANISM OF THE UV-INDUCED PALLADIUM DEPOSITION PROCESS FROM THIN SOLID PALLADIUM ACETATE FILMS [J].
ESROM, H ;
KOGELSCHATZ, U .
APPLIED SURFACE SCIENCE, 1990, 46 (1-4) :158-162
[4]   NEW APPROACH OF A LASER-INDUCED FORWARD TRANSFER FOR DEPOSITION OF PATTERNED THIN METAL-FILMS [J].
ESROM, H ;
ZHANG, JY ;
KOGELSCHATZ, U ;
PEDRAZA, AJ .
APPLIED SURFACE SCIENCE, 1995, 86 (1-4) :202-207
[5]  
Esrom H., 1989, Chemtronics, V4, P216
[6]  
Esrom H., 1989, Chemtronics, V4, P202
[7]   METAL-DEPOSITION WITH A WINDOWLESS VUV EXCIMER SOURCE [J].
ESROM, H ;
KOGELSCHATZ, U .
APPLIED SURFACE SCIENCE, 1992, 54 :440-444
[8]   COPPER DEPOSITION AND THERMAL-STABILITY ISSUES IN COPPER-BASED METALLIZATION FOR ULSI TECHNOLOGY [J].
LI, J ;
SHACHAMDIAMAND, Y ;
MAYER, JW .
MATERIALS SCIENCE REPORTS, 1992, 9 (01) :1-51
[9]  
Liu Y. S., 1989, Chemtronics, V4, P209
[10]  
Lowenheim F.A., 1974, Modern Electroplating