共 16 条
[5]
Esrom H., 1989, Chemtronics, V4, P216
[6]
Esrom H., 1989, Chemtronics, V4, P202
[8]
COPPER DEPOSITION AND THERMAL-STABILITY ISSUES IN COPPER-BASED METALLIZATION FOR ULSI TECHNOLOGY
[J].
MATERIALS SCIENCE REPORTS,
1992, 9 (01)
:1-51
[9]
Liu Y. S., 1989, Chemtronics, V4, P209
[10]
Lowenheim F.A., 1974, Modern Electroplating