Electro-thermomechanical behaviour of a Ti-45.0Ni-5.0Cu (at.%) alloy during shape memory cycling

被引:18
作者
De Araujo, CJ [1 ]
Morin, M [1 ]
Guénin, G [1 ]
机构
[1] Inst Natl Sci Appl Lyon, UMR CNRS 5510, GEMPPM, F-69621 Villeurbanne, France
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1999年 / 273卷
关键词
electrical resistance; thermal cycling; Ti-Ni-Cu; two-way shape memory effect;
D O I
10.1016/S0921-5093(99)00360-3
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In the present paper, electrical resistance (ER) changes are measured simultaneously with the stress-assisted two-way memory effect (SATWME) in Ti-45.0Ni-5.0Cu (at.%) wires during thermal cycling (max. 15 cycles) for several different stress levels. Interesting qualitative evolutions of the epsilon-ER-T loops during: cycling are observed as a function of the applied stress. On cooling, for stresses higher than 175 MPa, a clear deviation of the E-T curves is verified and the reversion of this anomaly is not observed during heating. After some cycles, serrations are frequently observed on the ER-T loops essentially below M-f and above A(f), indicating an interaction between the formation and reversion of oriented martensite variants with the defects introduced during the thermomechanical cycling. A linear relationship is observed between ER and a for the direct and reverse transformation ranges. The characteristic slope d(Delta R/R)/d epsilon is slightly dependent on the applied stress and on the number of thermal cycles. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:305 / 309
页数:5
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