共 10 条
[2]
Interface formation between metals (Cu, Ti) and low dielectric constant organic polymer (FLARE™ 1.0)
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1998, 16 (01)
:155-162
[7]
MOULDER JF, 1992, HDB XRAY PHOTOELECTR, P171
[9]
WENZEL C, 1998, ADV METALLIZATION IN, P131
[10]
Barriers for copper interconnections
[J].
ADVANCED INTERCONNECTS AND CONTACT MATERIALS AND PROCESSES FOR FUTURE INTEGRATED CIRCUITS,
1998, 514
:75-81