Synthesis and characterization of a positive-working, aqueous-base-developable photosensitive polyimide precursor

被引:13
作者
Hsu, SLC [1 ]
Lee, PI
King, JS
Jeng, JL
机构
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
[2] Ind Technol Res Inst, Mat Res Labs, Hsinchu 31015, Taiwan
关键词
polyimide; synthesis; photoresist;
D O I
10.1002/app.10969
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
A positive-working, aqueous-base-developable photosensitive polyimide precursor based on poly(amic ester)-bearing phenolic hydroxyl groups and a diazonaphthoquinone photosensitive compound was developed. The poly(amic ester) was prepared from a direct polymerization of 2,2'-bis-(3-amino-4-hydroxyphenyl)hexafluoropropane and bis(n-butyl)ester of pyromellitic acid in the presence of phenylphosphonic dichloride as an activator. Subsequently, the thermal imidization of the poly(amic ester) precursor at 300degreesC produced the corresponding polyimide. The inherent viscosity of the precursor polymer was 0.23 dL/g. The cyclized polyimide showed a glass-transition temperature at 356degreesC and a 5% weight loss at 474degreesC in nitrogen. The structures of the precursor polymer and the fully cyclized polymer were characterized by Fourier transform infrared spectroscopy and H-1-NMR. The photosensitive polyimide precursor containing 25 wt % diazonaphthoqrone, photoactive compound showed a sensitivity of 150 mJ/cm(2) and a contrast of 1.65 in a 3 mum film with 1.25 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 10 gm was obtained from this composition. (C) 2002 Wiley Periodicals, Inc.
引用
收藏
页码:352 / 358
页数:7
相关论文
共 17 条
[1]  
CHIN E, 1993, ADV POLYIMIDE SCI TE, P201
[2]  
DAMMEL R, 1993, SPIE TUTORIAL TEXT
[3]  
GHOSH MK, 1996, POLYMIDES FUNDAMENTA
[4]  
Haba O., 1997, J. Photopolym. Sci. Technol., V10, P55, DOI DOI 10.2494/PHOTOPOLYMER.10.55
[5]  
HAYASE RH, 1991, ADV RESIST TECHNOLOG, V1466, P438
[6]   SYNTHESIS AND CHARACTERISTICS OF ORGANIC SOLUBLE PHOTOACTIVE POLYIMIDES [J].
HO, BC ;
LIN, YS ;
LEE, YD .
JOURNAL OF APPLIED POLYMER SCIENCE, 1994, 53 (11) :1513-1524
[7]  
HORIE K, 1995, PHOTOSENSITIVE POLYM
[8]   NEW HIGH-TEMPERATURE STABLE POSITIVE PHOTORESISTS BASED ON HYDROXY POLYIMIDES AND POLYAMIDES CONTAINING THE HEXAFLUOROISOPROPYLIDENE (6-F) LINKING GROUP [J].
KHANNA, DN ;
MUELLER, WH .
POLYMER ENGINEERING AND SCIENCE, 1989, 29 (14) :954-959
[9]  
Loprest R. J., 1978, U.S. Patent, Patent No. [4,093,461A, 4093461]
[10]  
Naitoh K., 1993, POLYM ADVAN TECHNOL, V4, P294