Development of a titanium plasma etch process for uncooled titanium nanobolometer fabrication

被引：3

作者：

Gilmartin, Stephen F. ^{[1
]}

Arshak, Khalil ^{[1
]}

Bain, Dave ^{[2
]}

Lane, William A. ^{[2
]}

Collins, Damian ^{[3
]}

Arshak, Arousian ^{[4
]}

McCarthy, Brendan ^{[4
]}

Newcomb, Simon B. ^{[5
]}

Walsh, Michelle ^{[3
]}

机构：

[1] Univ Limerick, Dept Elect & Comp Engn, Limerick, Ireland

[2] Analog Devices Inc, Limerick, Ireland

[3] Boston Sci, Cork, Ireland

[4] Univ Limerick, Dept Phys, Limerick, Ireland

[5] Glebe Labs, Newport, Tipperary, Ireland

来源：

MICROELECTRONIC ENGINEERING | 2009年 / 86卷 / 4-6期

关键词：

Plasma etch; Titanium; Bolometer; Nanobolometer; EBL; MEMS; UNIFORMITY;

D O I：

10.1016/j.mee.2009.02.009

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];

摘要：

In this paper, we present our development of a BCl3/Cl-2 plasma etch for defining nanoscale titanium (Ti) features using a LAM Research 9600 metal plasma etch chamber. The nanoscale Ti plasma etch is used, for the first time, to define Ti nanobolometer sensor features used in a novel IR sensor process. We characterised the nanoscale etch in terms of five primary process parameters using a 16-run V fractional factorial experiment, to provide good estimates of all main effects and two-factor interactions. The experimental results determined the target levels for the etch process parameters. Our optimised nanoscale Ti etch module was then integrated within a CMOS/MEMs-compatible nanobolometer infrared (IR) sensor fabrication flow. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：971 / 975

页数：5

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