Resistance noise measurement: A better diagnostic tool to detect stress and current induced degradation

被引:10
作者
Vandamme, LKJ
VanKemenade, AJ
机构
[1] Electrical Engineering Department, Eindhoven University of Technology, 5600 Eindhoven
来源
MICROELECTRONICS AND RELIABILITY | 1997年 / 37卷 / 01期
关键词
D O I
10.1016/0026-2714(96)00241-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Mechanical stress and current-induced degradation can provoke holes and kinks in thin conducting films, resulting in a local increase in current density around these failures. This type of degradation resulting in holes or kinks in thin film resistances has been studied. A model describing the increase in 1/fnoise and resistance due to a local current density increase around failures is presented here. Our calculations are in agreement with experimental results obtained on carbon films damaged on purpose. It is shown quantitatively that 1/f noise is a more sensitive parameter than resistance measurements only. Noise measurement can be used as a fast and non-destructive technique for reliability testing of LSI Al interconnects and thin-film resistors on the condition that samples effectively contain not more than 10(13) free carriers. Copyright (C) 1996 Elsevier Science Ltd
引用
收藏
页码:87 / 93
页数:7
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