Novel interconnection technologies for integrated microfluidic systems

被引：140

作者：

Gray, BL

Jaeggi, D

Mourlas, NJ

van Drieënhuizen, BP

Williams, KR

Maluf, NI

Kovacs, GTA

机构：

[1] Lucas Nova Sensor, Fremont, CA 94539 USA

[2] Stanford Univ, Ctr Integrated Syst, Stanford, CA 94305 USA

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1999年 / 77卷 / 01期

关键词：

microfluidic systems; deep reactive ion etching; fluidic interconnects; injection molding; mixing; silicon bonding;

D O I：

10.1016/S0924-4247(99)00185-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new approach to realize silicon based integrated microfluidic systems is presented. By using a combination of silicon fusion bonding (SFB) and deep reactive ion etching (DRIE), multi-level fluidic 'circuit boards' are fabricated and used to integrate microfluidic components into hybrid systems. A multi-level laminating mixer and a manifold with multiple pressure sensors are presented as application examples. To interface the microfluidic system to the macroscopic world, three types of DRIE-fabricated, tight-fitting fluidic couplers for standard capillary tubes are described. One type of coupler is designed for minimal dead space, while another type reduces the risk of blocking capillaries with adhesive. A third design demonstrates for the first time a silicon/plastic coupler combining DRIE coupler technology with injection-molded press fittings. (C) 1999 Elsevier Science S.A. All rights reserved.

引用

页码：57 / 65

页数：9