Carbon nanotube via interconnect technologies: size-classified catalyst nanoparticles and low-resistance ohmic contact formation

被引：65

作者：

Awano, Y.

Sato, S.

Kondo, D.

Ohfuti, M.

Kawabata, A.

Nihei, M.

Yokoyama, N.

机构：

[1] Fujitsu Labs Ltd, Nanotechnol Res Ctr, Atsugi, Kanagawa 2430197, Japan

[2] Fujitsu Ltd, Atsugi, Kanagawa 2430197, Japan

来源：

PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2006年 / 203卷 / 14期

关键词：

Carbon nanotubes;

D O I：

10.1002/pssa.200622415

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We propose a new approach to fabricating carbon nanotube (CNT) via interconnects for future LSIs, which uses preformed catalyst nanoparticles to grow the CNTs. A newly designed impactor provided size-classified catalyst particles. For the new approach, we employ a TiN contact layer which is more resistant to oxidation and enables us to form a lower resistance ohmic contact between CNTs and wiring layers. The resultant CNT-via resistance was 0.59 Omega for 2-mu m vias, which is the smallest ever reported. We also study the CNT nucleation process using molecular dynamics and discuss how to remove amorphous carbon from the nucleation process. (c) 2006 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

引用

页码：3611 / 3616

页数：6

共 13 条

[1]

HATA K, 2004, SCIENCE, V19, P1275

[2] Quantum interference and ballistic transmission in nanotube electron waveguides [J].

Kong, J ;

Yenilmez, E ;

Tombler, TW ;

Kim, W ;

Dai, HJ ;

Laughlin, RB ;

Liu, L ;

Jayanthi, CS ;

Wu, SY .

PHYSICAL REVIEW LETTERS, 2001, 87 (10) :1-106801

[3] Carbon nanotubes in interconnect applications [J].

Kreupl, F ;

Graham, AP ;

Duesberg, GS ;

Steinhögl, W ;

Liebau, M ;

Unger, E ;

Hönlein, W .

MICROELECTRONIC ENGINEERING, 2002, 64 (1-4) :399-408

[4] Electronic properties of multiwalled carbon nanotubes in an embedded vertical array [J].

Li, J ;

Stevens, R ;

Delzeit, L ;

Ng, HT ;

Cassell, A ;

Han, J ;

Meyyappan, M .

APPLIED PHYSICS LETTERS, 2002, 81 (05) :910-912

[5] Low-temperature synthesis of high-purity single-walled carbon nanotubes from alcohol [J].

Maruyama, S ;

Kojima, R ;

Miyauchi, Y ;

Chiashi, S ;

Kohno, M .

CHEMICAL PHYSICS LETTERS, 2002, 360 (3-4) :229-234

[6] Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells [J].

Nihei, M ;

Kondo, D ;

Kawabata, A ;

Sato, S ;

Shioya, H ;

Sakaue, M ;

Iwai, T ;

Ohfuti, M ;

Awano, Y .

PROCEEDINGS OF THE IEEE 2005 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2005, :234-236

[7] Carbon nanotube vias for future LSI interconnects [J].

Nihei, M ;

Horibe, M ;

Kawabata, A ;

Awano, Y .

PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, :251-253

[8]

OHFUTI M, 2004, 26 FULL NAN GEN S OK, P1

[9]

OHFUTI M, 2005, 28 FULL NAN GEN S NA

[10]

OHFUTI M, 2004, 27 FULL NAN GEN S TO

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