Carbon nanotube vias for future LSI interconnects

被引：44

作者：

Nihei, M ^{[1
]}

Horibe, M ^{[1
]}

Kawabata, A ^{[1
]}

Awano, Y ^{[1
]}

机构：

[1] Fujitsu Ltd, Atsugi, Kanagawa 2430197, Japan

来源：

PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2004年

关键词：

D O I：

10.1109/IITC.2004.1345767

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows in parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2x10(6) A/cm(2), which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

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页码：251 / 253

页数：3

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