Future of microelectromechanical systems (MEMS)

被引:123
作者
Bao, MH [1 ]
Wang, WY [1 ]
机构
[1] SHANGHAI INST MET, SHANGHAI 200050, PEOPLES R CHINA
关键词
microelectromechanical systems;
D O I
10.1016/0924-4247(96)01274-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The development of microelectromechanical systems (MEMS) based on micromachining and microelectronics technologies has been significant for almost a decade. However, it is unrealistic to consider micromachining technology as a micro version of conventional machining technology. As a matter of fact, micromachining technology stemmed from the planar technology of silicon and is basically a two-dimensional processing technology. On the other hand, it is obvious that a micromachine cannot compare with a conventional machine in strength and power. For the successful development of MEMS in the future, a simple rule is suggested by the experience gained in the past few years: try to avoid as much as possible mechanical coupling with the outside world while trying hard to improve the MEMS technology to enhance the mechanical power of the devices. In addition to that, the strategy proven to be correct for the development of solid-state sensors also applies: MEMS devices should mainly be developed for new applications with a vast market. Their substitution for traditional applications should not be considered as a main strategy of development. Based on these arguments, the future development of MEMS devices and technologies is further discussed in the paper.
引用
收藏
页码:135 / 141
页数:7
相关论文
共 42 条
[1]  
Ahn C.H., 1993, 7TH P INT C SOL STAT, P70
[2]  
ALLEN MG, 1993, 7TH INT C SOL STAT S, P60
[3]  
ARQUINT P, 1993, 7TH P INT C SOL STAT, P921
[4]  
BARTH PW, 1995, 8 INT C SOL STAT SEN, V2, P276
[5]  
BENITEZ A, 1995, MICRO ELECTRO MECHANICAL SYSTEMS - IEEE PROCEEDINGS, 1995, P404, DOI 10.1109/MEMSYS.1995.472591
[6]  
BLOOMESTEIN TM, 1991, 6 INT C SOL SENS ACT, P507
[7]  
CARDOT F, 1993, 7TH P INT C SOL STAT, P32
[8]  
CHAN KHL, 1996, SENSOR ACTUAT A-PHYS, V52, P472
[9]  
CORE TA, 1993, SOLID STATE TECHNOL, V36, P39
[10]   INTEGRATED MOVABLE MICROMECHANICAL STRUCTURES FOR SENSORS AND ACTUATORS [J].
FAN, LS ;
TAI, YC ;
MULLER, RS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1988, 35 (06) :724-730