Wafer level packaging of micromachined gas sensors

被引：8

作者：

Raible, Stefan ^{[1
]}

Briand, Danick

Kappler, Juergen

de Rooij, Nicolaas F.

机构：

[1] AppliedSensor, D-72770 Reutlingen, Germany

[2] Univ Neuchatel, Inst Microtechnol, CH-2000 Neuchatel, Switzerland

来源：

IEEE SENSORS JOURNAL | 2006年 / 6卷 / 05期

关键词：

gas sensor; hotplate; metal oxide; packaging; wafer level package;

D O I：

10.1109/JSEN.2006.881355

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a novel approach to combine wafer level packaging (WLP) with micromachined hotplate gas-sensing elements. This concept allows liquid-tight sealing of gas sensor devices, which protects them during production (e.g., wafer dicing) and later in the application while still allowing the target gases to reach the sensing layer. The basis of the WLP is the combination of a structured Pyrex wafer with a micromachined substrate wafer. Thereafter, thick-film SnO2 layers are deposited and stabilized before a diffusion membrane is attached, which seals the wafer stack.

引用

收藏

页码：1232 / 1235

页数：4

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