Initiated chemical vapor deposition of polymer films on nonplanar substrates

被引:14
作者
Baxamusa, Salmaan H. [1 ]
Gleason, Karen K. [1 ]
机构
[1] MIT, Dept Chem Engn, Cambridge, MA 02139 USA
关键词
Initiated chemical vapor deposition; Polymers; Conformal; Step coverage; Patterns; STEP COVERAGE; TRENCHES; HOLES;
D O I
10.1016/j.tsf.2009.01.032
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thin polymer films are deposited on nonplanar geometries via initiated chemical vapor deposition (iCVD). Films in microtrenches exhibit step coverage of 0.85 for the highest aspect ratio trench studied here. An analytical model shows that the sticking probability of the initiating radical is a function of monomer surface concentration and takes values between 1.1 x 10(-2) and 5.0 x 10(-2) for the conditions studied here. These results indicate that iCVD proceeds via reaction of a vapor phase initiating radical with a surface adsorbed monomer. The high degree of conformality allows iCVD to be used to create patterns with features less than 10 mu m by physically masking the substrate. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码:3536 / 3538
页数:3
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