SOI power devices

被引:62
作者
Udrea, F
Garner, D
Sheng, K
Popescu, A
Lim, HT
Milne, WI
机构
[1] Univ Cambridge, Dept Engn, Elect Engn Div, Cambridge CB2 1PZ, England
[2] Univ Cambridge, Dept Engn, Power Devices Grp, Cambridge CB2 1PZ, England
来源
ELECTRONICS & COMMUNICATION ENGINEERING JOURNAL | 2000年 / 12卷 / 01期
关键词
D O I
10.1049/ecej:20000104
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper provides an introduction to silicon-on-insulator (SOI) technology and the operating principles of high-voltage SOI devices, reviews the performance of the available SOI switching devices in comparison with standard silicon devices, discusses the reasoning behind the use of SOI technology in power applications and briefly covers the most advanced novel power SOI devices proposed to date. The impact of SOI technology in power integrated circuits (PICs) and the problems associated with the integration of high-voltage and low-voltage CMOS are also briefly analysed.
引用
收藏
页码:27 / 40
页数:14
相关论文
共 34 条
[1]  
[Anonymous], 1979, IEDM
[2]  
ARNOLD E, 1994, INTERNATIONAL ELECTRON DEVICES MEETING 1994 - IEDM TECHNICAL DIGEST, P813, DOI 10.1109/IEDM.1994.383300
[3]  
Arnold E., 1992, P 4 INT S POW SEM DE, P242
[4]  
Auberton-Hervé AJ, 1999, ELEC SOC S, V99, P93
[5]  
CHARITAT G, 1992, P ISPSD, P213
[6]   A LATERAL COMFET MADE IN THIN SILICON-ON-INSULATOR FILM [J].
COLINGE, JP ;
CHIANG, SY .
IEEE ELECTRON DEVICE LETTERS, 1986, 7 (12) :697-699
[7]  
COLINGE JP, 1997, SILICON INSULATOR TE
[8]  
Disney D., 1992, P ISPSD, P48, DOI [10.1109/ISPSD.1992.991236, DOI 10.1109/ISPSD.1992]
[9]  
DISNEY DR, 1994, ISPSD '94 - PROCEEDINGS OF THE 6TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, P405
[10]   Simulated superior performances of semiconductor superjunction devices [J].
Fujihara, T ;
Miyasaka, Y .
ISPSD '98 - PROCEEDINGS OF THE 10TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 1998, :423-426