Thermoreflectance imaging of current dynamics in high power SiGe heterojunction bipolar transistors

被引:13
作者
Chan, Paddy K. L. [1 ]
Pipe, Kevin P.
Qin, Guoxuan
Ma, Zhenqiang
机构
[1] Univ Michigan, Dept Mech Engn, Ann Arbor, MI 48109 USA
[2] Univ Wisconsin, Dept Elect & Comp Engn, Madison, WI 53706 USA
关键词
CURRENT GAIN; TEMPERATURE; SIMULATION; JUNCTION; HBTS;
D O I
10.1063/1.2402947
中图分类号
O59 [应用物理学];
学科分类号
摘要
By generating high resolution two dimensional temperature images of electronic devices and linking heat dissipation to electrical current, the authors demonstrate that thermoreflectance measurements employing a charge-coupled device can provide a useful and nondestructive method for profiling current density in electronic devices. Here they apply this method to high power SiGe heterojunction bipolar transistors (HBTs) integrated in a commercial SiGe bipolar complementary metal-oxide-semiconductor platform, measuring the current carried by each subcell and quantifying current collapse under high-bias operation. They show that current hogging for a HBT with two emitter subcells can lead to one subcell carrying 81% of the total current. (c) 2006 American Institute of Physics.
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收藏
页数:3
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