共 36 条
[1]
ALI H, 1997, IEEE T COMP PACKAG B, V20
[2]
[Anonymous], P INT S VLSI TECHN S
[3]
BASTOS J, 1996, P IEEE INT C MICR TE, P27
[4]
EVALUATION OF PIEZORESISTIVE COEFFICIENT VARIATION IN SILICON STRESS SENSORS USING A 4-POINT BENDING TEST FIXTURE
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1992, 15 (05)
:904-914
[5]
Bittle D. A., 1991, Transactions of the ASME. Journal of Electronic Packaging, V113, P203, DOI 10.1115/1.2905397
[6]
Test chips for die stress characterization using arrays of CMOS sensors
[J].
PROCEEDINGS OF THE IEEE 1999 CUSTOM INTEGRATED CIRCUITS CONFERENCE,
1999,
:147-150
[7]
BRADLEY RC, 1998, P 24 EUR SOL STAT CI
[10]
CORDES RA, 1995, ASME EEP, V13, P109