A force-directed-based optimization scheme for thermal placement design of MCMs

被引:6
作者
Cheng, Hsien-Chie [1 ]
Huang, Yu-Che
Chen, Wen-Hwa
机构
[1] Feng Chia Univ, Dept Aerosp & Syst Engn, Taichung 407, Taiwan
[2] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 300, Taiwan
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2007年 / 30卷 / 01期
关键词
exterior penalty method (EPM); finite-element (FE) modeling; force-directed thermal model; multichip modules (MCMs); optimal chip placement design; Thermal management;
D O I
10.1109/TADVP.2006.890211
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thermal management becomes exceptionally critical to both the reliability and operation performance of electronic packages, particularly for multichip modules (MCMs), as packaging and power densities continue increase while packaging dimension continues decrease. The underlying goal of the study is to pursue the minimum system. temperature design of MCMs containing a number of chips of equal and/or unequal power through the optimal chip placement design. To deal with the thermal design problems, an effective indirect optimization approach that integrates a modified force-directed (FD) thermal model, a finite-element (FE) technique and an exterior penalty method (EPM) is proposed. In the modified FD thermal model, a novel representation of the repulsive and attractive forces is proposed, and the sum of these forces in the design system, representing the total system chip junction temperature, constructs the objective of the optimization problems. Together with some geometry constraints, the constrained optimization problems are formed, and furthermore, transformed into unconstrained optimization problems using an EPM. The solution of the optimization problems is sought through a direct, iterative search scheme with two proposed placement strategies. The alternative goal of the study is to address the feature and feasibility of these two proposed placement strategies for the current problems. The applicability of the proposed optimization approach is demonstrated through several design applications, and their results are extensively compared against the published data. It turns out that the current optimization approach can be very effective and robust in providing thermal optimal design of MCMs with a minimal total chip junction temperature through optimal chip placement.
引用
收藏
页码:56 / 67
页数:12
相关论文
共 17 条
[1]   Net-based force-directed macrocell placement for wirelength optimization [J].
Alupoaei, S ;
Katkoori, S .
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2002, 10 (06) :824-835
[2]   ON THE EXPERIMENTAL ATTAINMENT OF OPTIMUM CONDITIONS [J].
BOX, GEP ;
WILSON, KB .
JOURNAL OF THE ROYAL STATISTICAL SOCIETY SERIES B-STATISTICAL METHODOLOGY, 1951, 13 (01) :1-45
[3]  
Broyden C.G., 1970, J I MATH ITS APPL, V6, P76, DOI DOI 10.1093/IMAMAT/6.1.76
[4]   An effective methodology for thermal characterization of electronic packaging [J].
Chen, WH ;
Cheng, HC ;
Shen, HA .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (01) :222-232
[5]   Integration of simulation and response surface methods for thermal design of multichip modules [J].
Cheng, HC ;
Chen, WH ;
Chung, IC .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (02) :359-372
[6]  
Draper N., 2014, Applied Regression Analysis
[7]  
ELLISON GN, 1989, THERMAL COMPUATATION
[8]   A NEW APPROACH TO VARIABLE METRIC ALGORITHMS [J].
FLETCHER, R .
COMPUTER JOURNAL, 1970, 13 (03) :317-&
[9]   A FAMILY OF VARIABLE-METRIC METHODS DERIVED BY VARIATIONAL MEANS [J].
GOLDFARB, D .
MATHEMATICS OF COMPUTATION, 1970, 24 (109) :23-&
[10]  
HUANG Y, 2000, ASME, V122, P115