共 17 条
[3]
Broyden C.G., 1970, J I MATH ITS APPL, V6, P76, DOI DOI 10.1093/IMAMAT/6.1.76
[4]
An effective methodology for thermal characterization of electronic packaging
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2003, 26 (01)
:222-232
[5]
Integration of simulation and response surface methods for thermal design of multichip modules
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2004, 27 (02)
:359-372
[6]
Draper N., 2014, Applied Regression Analysis
[7]
ELLISON GN, 1989, THERMAL COMPUATATION
[10]
HUANG Y, 2000, ASME, V122, P115