Method for polymer hot embossing process development

被引:23
作者
Datta, Proyag [1 ]
Goettert, Jost [1 ]
机构
[1] Louisiana State Univ, CAMD, Baton Rouge, LA 70806 USA
来源
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2007年 / 13卷 / 3-4期
关键词
D O I
10.1007/s00542-006-0183-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Molding technologies associated with fabricating macro scale polymer components such as injection molding and hot embossing have been adapted with considerable success for fabrication of polymer microparts. While the basic principles of the process remain the same, the precision with which the processing parameters need to be controlled especially in the case of molding high aspect ratio (HAR) polymer microparts into polymer sheets is much greater than in the case of macro scale parts. It is seen that the bulk effects of the mold insert fixture and molding machine have a dominant influence on the molding parameters and that differences in material parameters such as the glass transition temperature (T (g)) of polymer sheets are critical for the success and typically differ from sheet to sheet. This makes it very challenging to establish standard processing parameters for hot embossing of sheet polymers. In the course of this paper, a methodology for developing a hot embossing process for HAR microstructures based on known material properties and considering the cumulative behavior of mold, material, and machine will be presented. Using this method force-temperature-deflection curves were measured with the intent of fine tuning the hot embossing process. Tests were carried out for different materials using a dummy mold insert yielding information that could be directly transferred to the actual mold insert with minimum development time and no risk of damage to the actual microstructures.
引用
收藏
页码:265 / 270
页数:6
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