Macroparticle interaction with a substrate in cathodic vacuum arc deposition

被引:34
作者
Keidar, M
Beilis, I
Boxman, RL
Goldsmith, S
机构
[1] Elec. Discharge and Plasma Lab., Tel Aviv University, Tel Aviv 69978
关键词
macroparticle interaction; cathodic vacuum arc deposition; temperature evolution;
D O I
10.1016/S0257-8972(96)02976-3
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The presence of macroparticles (MP) in the vacuum are cathodic jet is the critical problem of cathodic vacuum are deposition technology. The MP distribution on the substrate depends on MP generation, MP transport to the substrate, and the MP-substrate interaction. In the present work different aspects of the interaction of the MP with a substrate are studied theoretically. The MP temperature evolution during transport to the substrate was studied and it was found that the MP is liquid in the case of low melting point cathode materials. It was found that the MP temperature does not depend on the initial MP temperature in the near cathode region. Possible MP acceleration in the substrate direction resulting from ion friction was calculated by solving the equation of motion for the MP taking into account the plasma density and the velocity distribution obtained in previous analyses of the 2-D plasma expansion. The voltage drop in the substrate sheath as a function of the background pressure was calculated assuming charge exchange between ions and gas atoms. It was found that the voltage drop in this sheath increases with increasing background pressure p(g) by factor of 2 for p(g) similar to 1 Pa. The MP motion in this sheath was calculated taking into account MP charging and reflection from the substrate. The probability of reflection decreases with MP size, velocity, angle of the MP velocity vector with respect to the substrate, and increases with the background pressure.
引用
收藏
页码:415 / 420
页数:6
相关论文
共 22 条
[1]   REDUCTION IN MACROPARTICLES DURING THE DEPOSITION OF TIN FILMS PREPARED BY ARC ION PLATING [J].
AKARI, K ;
TAMAGAKI, H ;
KUMAKIRI, T ;
TSUJI, K .
SURFACE & COATINGS TECHNOLOGY, 1990, 43-4 (1-3) :312-323
[2]  
Aksenov I. I., 1984, Soviet Physics - Technical Physics, V29, P893
[3]   A STUDY OF THE MACROPARTICLE DISTRIBUTION IN CATHODIC-ARC-EVAPORATED TIN FILMS [J].
BAOUCHI, AW ;
PERRY, AJ .
SURFACE & COATINGS TECHNOLOGY, 1991, 49 (1-3) :253-257
[4]   ION CURRENT COLLECTED AT VARIOUS DISTANCES AND ARGON BACKGROUND PRESSURES IN A COPPER VACUUM-ARC [J].
BENSHALOM, A ;
BOXMAN, RL ;
GOLDSMITH, S .
IEEE TRANSACTIONS ON PLASMA SCIENCE, 1993, 21 (05) :435-439
[5]   PRINCIPLES AND APPLICATIONS OF VACUUM-ARC COATINGS [J].
BOXMAN, RL ;
GOLDSMITH, S .
IEEE TRANSACTIONS ON PLASMA SCIENCE, 1989, 17 (05) :705-712
[6]   MACROPARTICLE CONTAMINATION IN CATHODIC ARC COATINGS - GENERATION, TRANSPORT AND CONTROL [J].
BOXMAN, RL ;
GOLDSMITH, S .
SURFACE & COATINGS TECHNOLOGY, 1992, 52 (01) :39-50
[7]   THE INTERACTION BETWEEN PLASMA AND MACROPARTICLES IN A MULTI-CATHODE-SPOT VACUUM-ARC [J].
BOXMAN, RL ;
GOLDSMITH, S .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (01) :151-161
[8]   HEAT-TRANSFER FROM A RAREFIED PLASMA-FLOW TO A METALLIC PARTICLE WITH HIGH SURFACE-TEMPERATURE [J].
CHEN, X ;
CHEN, J ;
WANG, YD .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1994, 27 (08) :1637-1645
[9]  
DUSHMAN S, 1962, SCI FDN VACUUM TECHN, P51
[10]   TIXAL1-XN FILMS DEPOSITED BY ION PLATING WITH AN ARC EVAPORATOR [J].
FRELLER, H ;
HAESSLER, H .
THIN SOLID FILMS, 1987, 153 :67-74