Optoelectronic multichip modules for high-speed computer systems and communication networks

被引:5
作者
Koh, S
Sadler, DJ
Ahn, CH
机构
[1] UNIV CINCINNATI,CTR MICROELECT SENSORS,CINCINNATI,OH 45221
[2] MEMS,DEPT ELECT & COMP ENGN & COMPUT SCI,CINCINNATI,OH 45221
关键词
micro-opto-electro-mechanical systems; optoelectronic interconnection; multichip modules;
D O I
10.1117/1.601345
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
The demand for communication delay and connectivity improvements suggests that optoelectronic multichip modules (OE-MCMs), utilizing photonic and electronic technologies, may provide practical solutions for high-speed interconnection problems at the module level. Design and fabrication issues for integrating optical waveguide and multiple metal layers on a single substrate are described to facilitate the practical implementation of OE-MCMs. In particular, innovative device structures and fabrication strategies are proposed such that OE-MCMs can be fabricated in a batch mode by a well-established IC fabrication process without causing any fabrication compatibility problems. The proposed OE-MCMs utilize optoelectronic interconnection, multichip module packaging, and MEMS fabrication technologies at the module level, and the feasibility of the proposed OE-MCMs has been demonstrated through the fabrication, assembly, and characterization of prototypes. (C) 1997 Society of Photo-Optical Instrumentation Engineers.
引用
收藏
页码:1319 / 1325
页数:7
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