Optoelectronic multichip modules for high-speed computer systems and communication networks

被引：5

作者：

Koh, S

Sadler, DJ

Ahn, CH

机构：

[1] UNIV CINCINNATI,CTR MICROELECT SENSORS,CINCINNATI,OH 45221

[2] MEMS,DEPT ELECT & COMP ENGN & COMPUT SCI,CINCINNATI,OH 45221

来源：

OPTICAL ENGINEERING | 1997年 / 36卷 / 05期

关键词：

micro-opto-electro-mechanical systems; optoelectronic interconnection; multichip modules;

D O I：

10.1117/1.601345

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

The demand for communication delay and connectivity improvements suggests that optoelectronic multichip modules (OE-MCMs), utilizing photonic and electronic technologies, may provide practical solutions for high-speed interconnection problems at the module level. Design and fabrication issues for integrating optical waveguide and multiple metal layers on a single substrate are described to facilitate the practical implementation of OE-MCMs. In particular, innovative device structures and fabrication strategies are proposed such that OE-MCMs can be fabricated in a batch mode by a well-established IC fabrication process without causing any fabrication compatibility problems. The proposed OE-MCMs utilize optoelectronic interconnection, multichip module packaging, and MEMS fabrication technologies at the module level, and the feasibility of the proposed OE-MCMs has been demonstrated through the fabrication, assembly, and characterization of prototypes. (C) 1997 Society of Photo-Optical Instrumentation Engineers.

引用

页码：1319 / 1325

页数：7

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