Flat-band voltage control of a back-gate MOSFET by single ion implantation

被引:8
作者
Shinada, T
Ishikawa, A
Hinoshita, C
Koh, M
Ohdomari, I
机构
[1] Waseda Univ, Sch Sci & Engn, Shinjuku Ku, Tokyo 16985555, Japan
[2] Waseda Univ, Kagami Mem Lab Mat Sci & Technol, Shinjuku Ku, Tokyo 1690051, Japan
基金
日本学术振兴会;
关键词
single ion implantation; focused ion beam; fluctuation; doping; impurity; dopant number;
D O I
10.1016/S0169-4332(00)00239-7
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In order to control the electrical characteristics of semiconductor fine structures, several tens of single-dopant ions were implanted one by one into sub-micron semiconductor regions by means of single ion implantation (SII). The flat-band voltage of the implanted test samples (a back-gate MOSFET) were measured by the extrapolation of the linear part of substrate bias (V-BG)-drain current (I-D) characteristics to V-BG axis. The flat-band voltage decreased linearly with the number of implanted ions. The linear relationship between the flat-band voltage and the number of implanted ions verifies the controllability of device characteristics with the SII. The increase in the flat-band voltage per one dopant atom has been found to be -4.5 mV/ion in this study. (C) 2000 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:499 / 503
页数:5
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