A reliable single-layer out-of-plane micromachined thermal actuator

被引：44

作者：

Chen, WC ^{[1
]}

Chu, CC ^{[1
]}

Hsieh, JW ^{[1
]}

Fang, WL ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Power Mech Engn Dept, Hsinchu, Taiwan

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2003年 / 103卷 / 1-2期

关键词：

thermal actuator; delamination; bulk micromachining; fatigue test;

D O I：

10.1016/S0924-4247(02)00315-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Out-of-plane electrothermal actuators have been applied to a variety of fields with the bimorph effect being the most commonly used driving method, due to simple fabrication process. However, such an experiences a shear force at the interface of different materials, while actuated. Delamination therefore takes place and decreases its lifetime. In this study, a novel bi-directional out-of-plane electrothermal actuator is designed and fabricated. Unlike the bi-metal and hot-cold arm thermal actuator, this actuator can move in two directions. Since this actuator is consisted of only single-layer thin film material, it can prevent from delamination. According to the static load-deflection test, this actuator can achieve bi-directional actuation with amplitude near 6-7 mum when driven at 5 V. According to the vibration test, the dynamics of significant output when driven near 40 kHz. The actuator were experienced a fatigue test which shows that its resonant frequency remains unchanged after 10(9) cycles of continous operation which driving voltage at 2.25 V.

引用

页码：48 / 58

页数：11

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