High drop test reliability: Lead-free solders

被引：65

作者：

Amagai, M ^{[1
]}

Toyoda, Y ^{[1
]}

Ohnishi, T ^{[1
]}

Akita, S ^{[1
]}

机构：

[1] Texas Instruments Inc, Tsukuba Technol Ctr, SC Package Dev, Tsukuba, Ibaraki 3050841, Japan

来源：

54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年

关键词：

lead free solder; nickel; phosphorus; indium; drop test; Sn-Ag-Cu; solder alloys;

D O I：

10.1109/ECTC.2004.1320281

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Recently, preventing environmental pollutions, lead-free (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. Sn-Ag-Cu-P was developed last year, but Sn-Ag-Cu-P alloys were not satisfied to meet sever customer requirements like thermal aging process followed by drop tests. To improve drop test performance after thermal aging process, the combination of Indium and Nickel was investigated. After the effect of Indium. and Nickel on Kirkendall voids and Cu3Sn growth thickness was studied, the weight ratio of Indium. per Nickel were optimized. Based on the results of board level reliability tests, new lead free solder has been developed. This paper presents the optimum Nickel and Indium including in Sn-Ag-Cu based solder alloys.

引用

页码：1304 / 1309

页数：6

共 4 条

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[2] Chip Scale Package (CSP) solder joint reliability and modeling [J].

Amagai, M .

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[3]

AMAGAI M, 1999, J ELESVIER SCI MICRO, P463

[4]

LAU JH, 1997, SOLDER JOINT RELIABI, P1

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