共 8 条
- [1] ACCELERATED-DEPOSITION RATE AND HIGH-QUALITY FILM COPPER CHEMICAL-VAPOR-DEPOSITION USING A WATER-VAPOR ADDITION TO A HYDROGEN AND CU(HFA)(2) REACTION SYSTEM [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1993, 32 (9A): : 3915 - 3919
- [2] JUPPO M, 1995, 3 BALT ALE S C ABST, P21
- [3] Kodas T.T., 1994, The Chemistry of Metal CVD
- [4] LECOHIER B, 1991, J PHYS S, V1, P287
- [5] Atomic layer epitaxy of copper on tantalum [J]. CHEMICAL VAPOR DEPOSITION, 1997, 3 (01) : 45 - 50
- [7] Suntola T., 1989, Material Science Reports, V4, P261, DOI 10.1016/S0920-2307(89)80006-4
- [8] ZENG B, 1992, APPL PHYS LETT, V61, P2175