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Focused ion beam processing for microscale fabrication

被引：17
作者：
Walker, JF
Moore, DF
Whitney, JT
机构：
[1] FEI Europe Ltd., Cottenham, Cambs.
[2] Cambridge University, Engineering Department, Cambridge
来源：
MICROELECTRONIC ENGINEERING | 1996年 / 30卷 / 1-4期
关键词：
D O I：
10.1016/0167-9317(95)00299-5
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recent advances in focused ion beam (FIB) technology, towards finer focus and higher current density, have made micromachining by FIB both an attractive ideal and a commercial reality. We demonstrate new applications in micro-electro-mechanical systems (MEMS) and sensors, high-resolution trimming of YBaCuO superconducting devices, and transmission electron microscopy (TEM) sample preparation which rely on the precision milling and high resolution imaging available from FIB.
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页码：517 / 522
页数：6
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