An electroformed CMOS integrated angular rate sensor

被引:22
作者
Chang, S
Chia, M
Castillo-Borelley, P
Higdon, W
Jiang, Q
Johnson, J
Obedier, L
Putty, M
Shi, Q
Sparks, D
Zarabadi, S
机构
[1] Delphi Delco Elect Syst, Kokomo, IN 46904 USA
[2] GM Corp, Res Ctr, Warren, MI 48090 USA
关键词
angular rate sensors; electroforming; yaw; CMOS; gyroscopes; LIGA;
D O I
10.1016/S0924-4247(97)01761-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A CMOS integrated, surface-micromachined angular rate sensor utilizing an electroformed vibrating metal ring structure on a silicon IC has been developed. Substantial signal-conditioning circuitry is included on the IC with the vibrating structure. Tests of the sensor demonstrate that its performance is equivalent to that required for a variety of angular rate applications. Stiction of electroformed micromachines and other reliability issues will be discussed. (C) 1998 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:138 / 143
页数:6
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