Microstructure and electrical properties of Ti-Si-C-Ag nanocomposite thin films

被引:23
作者
Eklund, P. [1 ]
Joelsson, T.
Ljungcrantz, H.
Wilhelmsson, O.
Czigany, Zs.
Hogberg, H.
Hultman, L.
机构
[1] Linkoping Univ, Thin Films Phys Div, Dept Phys Chem & Biol, IFM, S-58183 Linkoping, Sweden
[2] Impact Coatings AB, S-58216 Linkoping, Sweden
[3] Univ Uppsala, Angstrom Lab, Dept Chem Mat, S-75121 Uppsala, Sweden
关键词
sputtering; titanium carbide; silver; resistivity; X-ray diffraction; electron microscopy;
D O I
10.1016/j.surfcoat.2006.12.016
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Ti-Si-C-Ag nanocomposite coatings consisting of nanocrystalline TiC in an amorphous Si matrix with segregated Ag were deposited by dual magnetron sputtering from Ti3SiC2 and Ag targets. As evidenced by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy, for Ag contents below 10 at.%, the Ag forms similar to 10 nm large crystallites that are homogeneously distributed in the films. For higher Ag contents, coalescence during growth results in the formation of > similar to 100 nm Ag islands on the film surface. The electrical resistivity of the coatings was measured in a four-point-probe setup, and ranged from 340 mu Omega cm (for Ti-Si-C coatings without Ag) to 40 mu Omega cm (for high Ag content). (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:6465 / 6469
页数:5
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