Etchant solutions for the removal of Cu(0) in a supercritical CO2-based "dry" chemical mechanical planarization process for device fabrication

被引：48

作者：

Bessel, CA

Denison, GM

DeSimone, JM

DeYoung, J

Gross, S

Schauer, CK

Visintin, PM

机构：

[1] Univ N Carolina, Dept Chem, Chapel Hill, NC 27599 USA

[2] N Carolina State Univ, Dept Chem Engn, Raleigh, NC 27695 USA

[3] Villanova Univ, Dept Chem, Villanova, PA 19085 USA

[4] Micell Technol, Raleigh, NC 27613 USA

来源：

关键词：

D O I：

10.1021/ja034091m

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

[No abstract available]

引用

页码：4980 / 4981

页数：2