Effect of Sn content on the electrical properties and thermal conductivity of Pb1-xSnxTe

被引:17
作者
Orihashi, M
Noda, Y
Chen, LD
Hirai, T
机构
[1] Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan
[2] Shimane Univ, Fac Sci & Engn, Dept Mat Sci, Matsue, Shimane 6908504, Japan
来源
MATERIALS TRANSACTIONS JIM | 2000年 / 41卷 / 09期
关键词
lead tin telluride; thermoelectric material; solid solution; Hall mobility; thermal conductivity;
D O I
10.2320/matertrans1989.41.1196
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
P-type Pb1-xSnxTe single crystals were prepared by the Bridgman method with different Sn content (x). Electrical conductivity (sigma), Hall coefficient (R-H) and thermal conductivity (kappa) were measured in the temperature range from 300 to 700 K. The hole concentration (p) at 77K changed in the range from 2.2 x 10(24) to 4.9 x 10(26) m(-3) for a whole composition range, 0.0 less than or equal to x less than or equal to 1.0. The sigma increased monotonously with increasing x, while the kappa value exhibited a minimum at x = 0.25. The lattice thermal conductivity (kappa (lattice)) also changed with x showing a minimum at x = 0.25 similar to 0.50. The carrier thermal conductivity (kappa (carrier)) was found to increase monotonously with increasing x. The ratio (sigma/kappa) Of electrical conductivity to thermal conductivity was found to have a maximum at x = 0.50. These results indicate that the electrical and thermal properties are sensitively influenced by phonon scattering by the disordered atomic arrangements in the solid solution. The possible enhancement of thermoelectric performance was suggested by forming the Pb1-xSnxTe sold solutions.
引用
收藏
页码:1196 / 1201
页数:6
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