Monolithic integration of RF MEMS switches with a diversity antenna on PCB substrate

被引：81

作者：

Cetiner, BA ^{[1
]}

Qian, JY ^{[1
]}

Chang, HP ^{[1
]}

Bachman, M ^{[1
]}

Li, GP ^{[1
]}

De Flaviis, F ^{[1
]}

机构：

[1] Univ Calif Irvine, Dept Elect Engn & Comp Sci, Irvine, CA 92717 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2003年 / 51卷 / 01期

关键词：

RF microelectromechanical system (MEMS); switches; monolithic integration; low-temperature process; printed circuit board (PCB);

D O I：

10.1109/TMTT.2002.806521

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel process for monolithic integration of RF microelectromechanical system (MEMS) switches with three-dimensional antenna elements on a microwave laminate printed circuit board (PCB) is presented. This process calls for a low-temperature (90degreesC-170degreesC) high-density inductively coupled plasma chemical vapor deposition technique that allows the choice of any PCB substrate, such as RO4003-FR4 (epsilon(r) = 3.38, tan delta = 0.002), with the desired electrical properties for antenna applications. A two-element diversity antenna system monolithically integrated with RF MEMS switches is designed and demonstrated.

引用

页码：332 / 335

页数：4

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