Fracture of Sn-3.5%Ag solder alloy under creep

被引：20

作者：

Igoshev, VI

Kleiman, JI

Shangguan, D

Wong, S

Michon, U

机构：

[1] Integr Testing Lab Inc, Markham, ON L3R 2R7, Canada

[2] Visteon Automot Syst, Dearborn, MI 48121 USA

[3] Visteon Automot Syst, Markham, ON, Canada

[4] Univ Orleans, ESPEO 3, F-45067 Orleans, France

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2000年 / 29卷 / 12期

关键词：

crack nucleation and propagation; microstructure; creep deformation;

D O I：

10.1007/s11664-000-0119-z

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Experimental data on the creep and failure of the Sn-3.0%Ag, Sn-3.5%Ag, and Sn-4.0%Ag lead free solder alloys are described. Further development of the alloys' failure micromechanism, proposed earlier, is presented. Possible ways of improving the mechanical properties of Sn-Ag-based solder alloys are discussed.

引用

页码：1356 / 1361

页数：6

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