Atomic force microscopy observations of successive damaging mechanisms of thin films on substrates under tensile stress

被引：19

作者：

George, M ^{[1
]}

Coupeau, C ^{[1
]}

Colin, J ^{[1
]}

Grilhé, J ^{[1
]}

机构：

[1] Univ Poitiers, CNRS, UMR 6630, Met Phys Lab, F-86962 Futuroscope, France

来源：

THIN SOLID FILMS | 2003年 / 429卷 / 1-2期

关键词：

thin films; atomic force microscopy; mechanical properties; tensile testing;

D O I：

10.1016/S0040-6090(03)00066-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Atomic force microscopy has been used to characterize the evolution of cracks in a 100 ran thick nickel film on a polyimide substrate under increasing tensile stresses. Successive damaging mechanisms are described and discussed by means of finite element calculations. (C) 2003 Elsevier Science B.V. All rights reserved.

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收藏

页码：267 / 272

页数：6

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