Determination of acid diffusion parameters and proximity effect correction for highly dense 0.15 mu m features on SAL-601

被引:6
作者
Raptis, I
机构
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1997年 / 36卷 / 10期
关键词
chemically amplified resists; proximity effect correction; electron beam lithography; acid diffusion coefficient; post-exposure bake; triple Gaussian;
D O I
10.1143/JJAP.36.6562
中图分类号
O59 [应用物理学];
学科分类号
摘要
A new method for the measurement of acid diffusion parameters in negative-tone e-beam chemically amplified resists and its application for proximity effect correction is presented. It is based on the measurement. of the diameter of lithographic features (pillars) obtained from single-pixel e-beam exposures. Generally, long post exposure bake (FEB) times or low post apply bake (PAB) temperatures lead to wider features compared with short PEB times and high PAB temperatures, due to enhanced acid diffusion. The acid diffusion coefficient was found to depend exponentially on cross-linking density. Additionally, proximity effect correction parameters (triple Gaussian parameters) are easily calculated, These parameters are t(PEB) dependent and in the limit (t(PEB) --> 0) are almost equal to the corresponding values for non-amplified resists, The method has been applied to SAL-601 (Shipley), and the calculated proximity parameters were used successfully to correct the proximity effect of complicated layouts with a 0.15 mu m critical dimension.
引用
收藏
页码:6562 / 6571
页数:10
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