Reliability of composite solder bumps produced by an in-situ process

被引：18

作者：

Lee, JH ^{[1
]}

Park, D

Moon, JT

Lee, YH

Shin, DH

Kim, YS

机构：

[1] Hongik Univ, Dept Met & Mat Sci, Seoul, South Korea

[2] Hyundai Elect Ind, Device & Semicond Res Div, Kyonggi Do, South Korea

[3] Hanyang Univ, Dept Met & Mat Sci, Ansan, South Korea

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2000年 / 29卷 / 10期

关键词：

In-situ composite; Cu6Sn5; dispersoid; thermal stability; reaction rate; shear strength;

D O I：

10.1007/s11664-000-0022-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Gu,Sn, dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.

引用

页码：1264 / 1269

页数：6

共 25 条

[1] PROCESSING DISPERSION-STRENGTHENED SN-PB SOLDERS TO ACHIEVE MICROSTRUCTURAL REFINEMENT AND STABILITY [J].