Polymer deformation and filling modes during microembossing

被引:85
作者
Rowland, HD [1 ]
King, WP [1 ]
机构
[1] Georgia Inst Technol, Woodruff Sch Mech Engn, Atlanta, GA 30329 USA
关键词
D O I
10.1088/0960-1317/14/12/005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work investigates the initial stages of polymer deformation during hot embossing micro-manufacturing at processing temperatures near the glass transition temperature (T-g) of polymer films having sufficient thickness such that polymer flow is not supply limited. Several stages of polymer flow can be observed by employing stamp geometries of various widths and varying imprint conditions of time and temperature to modulate polymer viscosity. Experiments investigate conditions affecting cavity filling phenomena, including apparent polymer viscosity. Stamps with periodic ridges of height and width 4 mum and periodicity 30, 50 and 100 mum emboss trenches into polymethyl methacrylate films at T-g - 10degreesC < T-emboss < T-g + 20degreesC. Imprint parameters of time, temperature and load are correlated with replicated polymer shape, height and imprinted area. Polymer replicates are measured by atomic force microscopy and inspected by scanning electron microscopy. Cavity size and the temperature dependence of polymer viscosity significantly influence the nature of polymer deformation in hot embossing micro-manufacturing and must be accounted for in rational process design.
引用
收藏
页码:1625 / 1632
页数:8
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