An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

被引：110

作者：

Murali, S ^{[1
]}

Srikanth, N ^{[1
]}

Vath, CJ ^{[1
]}

机构：

[1] ASM Technol Singapore Pte Ltd, Res & Dev Unit, Singapore 768924, Singapore

来源：

MATERIALS RESEARCH BULLETIN | 2003年 / 38卷 / 04期

关键词：

semiconductors; intermetallic compounds; diffusion; microstructure;

D O I：

10.1016/S0025-5408(03)00004-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In IC packages, thermosonic wire bonding is the preferred method for making electrical connections between the die pad and lead frame. These interconnect are made using fine metal wires. On thermal aging (under 175 degreesC for 5 h) gold aluminide easily forms in gold ball bonds while formation of intermetallic compound is absent in case of copper ball bonds. An analysis of the atomic property of the elements bonded explains that atomic radii and electronegativity factors favor gold aluminide formation. (C) 2003 Elsevier Science Ltd. All rights reserved.

引用

页码：637 / 646

页数：10

共 14 条

[1]

[Anonymous], P SEM C SING SING MA

[2]

CHEN YH, 1977, SCRIPTA METALL MATER, V11, P725, DOI 10.1016/0036-9748(77)90065-5

[3]

COTTRELL AH, 1954, THEORETICAL STRUCTUR, P125

[4]

Finar I. L., 1967, ORGANIC CHEM FUNDAME, V1

[5]

HARMAN GG, 1989, WIRE BONDING MICROEL

[6] Degradation of gold-aluminium ball bonds by aging and contamination [J].

Koeninger, V ;

Uchida, HH ;

Fromm, E .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (04) :835-841

[7]

Kurtz J., 1984, P 34 EL COMP C, P1

[8]

MURALI S, 2002, P SEMICON C SING 6 9, V3, P127

[9] INTERMETALLIC FORMATION IN GOLD-ALUMINUM SYSTEMS [J].

PHILOFSKY, E .

SOLID-STATE ELECTRONICS, 1970, 13 (10) :1391-+

[10]

Shackelford J.F., 1992, CRC MAT SCI ENG HDB

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