Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

Molecular dynamics (MD) simulation was conducted to investigate the coalescence of Cu nanoparticles and their deposition on a Cu substrate at various temperatures from 400 K to 1,000 K using the embedded atom method (EAM). The x-z plane projection, spreading index, coalescence index, and pair-correlation distribution were analyzed to gain more insight into the sintering process. Simulation results showed that even at a low temperature of 400 K, metal spheres can be collapsed and deposited on the substrate. Yet higher temperatures were helpful in enhancing the degree of collapsing and deposition.