Tri-layer systems for nanoimprint lithography with an improved process latitude

We present two tri-layer systems which can be used to improve the process latitude of nanoimprint lithography. By hot empossing, the top layer polymer can easily deformed while the bottom layer, separated by a 10 nm thick germanium from the top layer, remains to be thermally stable. With a sequential reactive ion etching, the top layer image can be transferred into the bottom layer with a large thickness contrast, thereby providing a way to generate dense features with high aspect ratio. Consequently, commonly used pattern-transfer techniques such as lift-off, reactive ion etching and electrodeposition can be employed.