Electroplating Ni micro-cantilevers for low contact-force IC probing

被引：47

作者：

Kataoka, K

Kawamura, S

Itoh, T

Ishikawa, K

Honma, H

Suga, T

机构：

[1] Univ Tokyo, Adv Sci & Technol Res Ctr, Meguro Ku, Tokyo 1538904, Japan

[2] Kanto Gakuin Univ, Kanazawa Ku, Yokohama, Kanagawa 2360032, Japan

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2003年 / 103卷 / 1-2期

关键词：

fritting; electroplated nickel; MEMS probe card; electric contact;

D O I：

10.1016/S0924-4247(02)00312-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present a new MEMS probe card made of electroplated nickel micro-cantilevers, which has compliant structures, and uses a kind of electric breakdown, or fritting, to make electric contacts to electrodes on ICs. The characteristics of fritting contact between nickel probe and Al electrodes were investigated, and nickel was found to have lower contact resistance than other materials. A micro-machining process for the probe cards, including deposition of layers having different internal stress to make a protruding cantilever shape, was developed. It was found that the fritting process using the micro-cantilevers could make the low-resistance contacts with the force of less than a few micronewtons. (C) 2003 Elsevier Science B.V. All rights reserved.

引用

页码：116 / 121

页数：6

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