Galvanic displacement of BixTey thin films from sacrificial iron group thin films

被引:14
作者
Chang, Chong Hyun [1 ]
Rheem, Youngwoo [1 ]
Choa, Yong-Ho [2 ]
Park, Deok-Yong [3 ]
Myung, Nosang V. [1 ]
机构
[1] Univ Calif Riverside, Dept Chem & Environm Engn, Riverside, CA 92521 USA
[2] Hanyang Univ, Dept Fine Chem Engn, Ansan 426791, South Korea
[3] Hanbat Natl Univ, Dept Appl Mat Engn, Taejon 305719, South Korea
关键词
Electrochemical process; Galvanic displacement; Bismuth telluride; Thin films; Thermoelectric materials; Semiconducting materials; ONE-DIMENSIONAL NANOSTRUCTURES; TELLURIUM NANOTUBES; ELECTROCHEMICAL DEPOSITION; TRIGONAL TELLURIUM; GROWTH-MECHANISM; P-TYPE; BI2TE3; NANOWIRES; SILICON; SURFACES;
D O I
10.1016/j.electacta.2009.09.066
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
BixTey thin films synthesized by galvanic displacement were systematically investigated by observing open circuit potential (OCP), surface morphology, microstructure and film composition. Surface morphologies and crystal structures of synthesized BixTey thin films were strongly depended on the type of the sacrificial materials (i.e., nickel (Ni), cobalt (Co) and iron (Fe)). Galvanically deposited BixTey thin films from the sacrificial Ni and Co thin films exhibited Bi2Te3 intermetallic compounds and hierarchical structures with backbones and sub-branches. A linear relationship of deposited Bi content in BixTey thin films as a function of [Bi3+]/[HTeO2+] ratio (within a range of less than 0.8) in the electrolyte was also observed. Surface morphologies of BixTey thin films were altered with the film composition. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1072 / 1080
页数:9
相关论文
共 40 条
[1]   Galvanic replacement reaction on metal films: A one-step approach to create nanoporous surfaces for catalysis [J].
Bansal, Vipul ;
Jani, Harit ;
Du Plessis, Johan ;
Coloe, Peter J. ;
Bhargava, Suresh K. .
ADVANCED MATERIALS, 2008, 20 (04) :717-+
[2]   Synthesis and characterization of porous platinum layers deposited on highly doped N-type porous silicon by immersion plating [J].
Brito-Neto, Jose Geraldo Alves ;
Araki, Shintaro ;
Hayase, Masanori .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (11) :C741-C746
[3]   SELECTIVE METAL-DEPOSITION ON SILICON SUBSTRATES [J].
CACHET, H ;
FROMENT, M ;
SOUTEYRAND, E ;
DENNIG, C .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (10) :2920-2925
[4]   Selective metallization of silicon micromechanical devices [J].
Carraro, C ;
Magagnin, L ;
Maboudian, R .
ELECTROCHIMICA ACTA, 2002, 47 (16) :2583-2588
[5]   Metallization and nanostructuring of semiconductor surfaces by galvanic displacement processes [J].
Carraro, Carlo ;
Maboudian, Roya ;
Magagnin, Luca .
SURFACE SCIENCE REPORTS, 2007, 62 (12) :499-525
[6]   Survey of the metal nucleation processes on silicon surfaces in fluoride solutions:: from dilute HF to concentrated NH4F solutions [J].
Chemla, M ;
Homma, T ;
Bertagna, V ;
Erre, R ;
Kubo, N ;
Osaka, T .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2003, 559 :111-123
[7]   Controlled synthesis of crystalline tellurium nanorods, nanowires, nanobelts and related structures by a self-seeding solution process [J].
Gautam, UK ;
Rao, CNR .
JOURNAL OF MATERIALS CHEMISTRY, 2004, 14 (16) :2530-2535
[8]   Amino acids controlled growth of shuttle-like scrolled tellurium nanotubes and nanowires with sharp tips [J].
He, ZB ;
Yu, SH ;
Zhu, JP .
CHEMISTRY OF MATERIALS, 2005, 17 (11) :2785-2788
[9]  
Kelcher S, 2005, PLAT SURF FINISH, V92, P24
[10]   Controllable synthesis of Bi2Te3 intermetallic compounds with hierarchical nanostructures via electrochemical deposition route [J].
Li, Gao-Ren ;
Zheng, Fu-Lin ;
Tong, Ye-Xiang .
CRYSTAL GROWTH & DESIGN, 2008, 8 (04) :1226-1232