Revisiting phase shifting masks in x-ray lithography

被引:5
作者
Khan, M [1 ]
Bollepalli, S [1 ]
Cerrina, F [1 ]
机构
[1] Univ Wisconsin, Ctr Xray Lithog, Stoughton, WI 53589 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1997年 / 15卷 / 06期
关键词
D O I
10.1116/1.589624
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this article, we describe a framework for selecting the materials for phase shift masks (PSMs) in x-ray lithography to yield the optimal exposure latitude. Traditional design of PSMs involves choosing the thickness of the material to produce a pi phase shift, as in the case of clear phase shifting masks, or to produce the sufficient contrast needed for imaging with a requisite phase shift to improve linewidth control, as in the cases of attenuated phase shifting masks and half-tone phase shifting masks. We instead find the optical constants of a theoretical material that yield optimal exposure latitude, and try to find combinations or alloys of various materials that have the requisite optical constants. (C) 1997 American Vacuum Society.
引用
收藏
页码:2255 / 2258
页数:4
相关论文
共 9 条
[1]  
BOLLEPALLI S, 1997, STUDY AERIAL IMAGE Q
[2]   MODELING X-RAY PROXIMITY LITHOGRAPHY [J].
GUO, JZY ;
CERRINA, F .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1993, 37 (03) :331-349
[3]  
HECTOR SD, COMMUNICATION
[4]  
Henke B. L., 1982, Atomic Data and Nuclear Data Tables, V27, P1, DOI 10.1016/0092-640X(82)90002-X
[5]  
HENKE BL, 1981, AIP C P, V75, P146
[6]   USE OF A PI-PHASE SHIFTING X-RAY MASK TO INCREASE THE INTENSITY SLOPE AT FEATURE EDGES [J].
KU, YC ;
ANDERSON, EH ;
SCHATTENBURG, ML ;
SMITH, HI .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1988, 6 (01) :150-153
[7]  
LINFOOT EA, 1970, FOURIER ANAL IMAGE Q
[8]   METALLESS X-RAY PHASE-SHIFT MASKS FOR NANOLITHOGRAPHY [J].
WHITE, V ;
CERRINA, F .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1992, 10 (06) :3141-3144
[9]   MODELING IMAGE-FORMATION - APPLICATION TO MASK OPTIMIZATION [J].
XIAO, JB ;
KHAN, M ;
NACHMAN, R ;
WALLACE, J ;
CHEN, Z ;
CERRINA, F .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (06) :4038-4043