共 51 条
Mechanical Stimulation Mediates Gene Expression in MC3T3 Osteoblastic Cells Differently in 2D and 3D Environments
被引:25
作者:
Barron, Matthew J.
[1
]
Tsai, Chung-Jui
[2
,3
]
Donahue, Seth W.
[1
]
机构:
[1] Michigan Technol Univ, Dept Biomed Engn, Houghton, MI 49849 USA
[2] Univ Georgia, Dept Genet, Athens, GA 30602 USA
[3] Univ Georgia, Sch Forestry & Nat Resources, Athens, GA 30602 USA
来源:
JOURNAL OF BIOMECHANICAL ENGINEERING-TRANSACTIONS OF THE ASME
|
2010年
/
132卷
/
04期
基金:
美国国家科学基金会;
关键词:
mechanotransduction;
bone tissue engineering;
gene expression;
shear stress;
MINERALIZED MATRIX DEPOSITION;
OSCILLATORY FLUID-FLOW;
MARROW STROMAL CELLS;
PERFUSION CULTURE;
GROWTH-FACTOR;
IN-VIVO;
OSTEOGENIC DIFFERENTIATION;
COLLAGEN-GLYCOSAMINOGLYCAN;
DISTRACTION OSTEOGENESIS;
MOLECULAR REGULATION;
D O I:
10.1115/1.4001162
中图分类号:
Q6 [生物物理学];
学科分类号:
071011 [生物物理学];
摘要:
Successful bone tissue engineering requires the understanding of cellular activity in three-dimensional (3D) architectures and how it compares to two-dimensional (2D) architecture. We developed a perfusion culture system that utilizes fluid flow to mechanically load a cell-seeded 3D scaffold. This study compared the gene expression of osteoblastic cells in 2D and 3D cultures, and the effects of mechanical loading on gene expression in 2D and 3D cultures. MC3T3-E1 osteoblastlike cells were seeded onto 2D glass slides and 3D calcium phosphate scaffolds and cultured statically or mechanically loaded with fluid flow Gene expression of OPN and FGF-2 was upregtdated at 24 h and 48 h in 3D compared with 2D static cultures, while collagen I gene expression was downregulated. In addition, while flow increased OPN in 2D culture at 48 h, it decreased both OPN and FGF-2 in 3D culture. In conclusion, gene expression is different between 2D and 3D osteoblast cultures under static conditions. Additionally, osteoblasts respond to shear stress differently in 2D and 3D cultures. Our results highlight the importance of 3D mechanotransduction studies for bone tissue engineering applications. [DOI: 10.1115/1.4001162]
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