Dissolution of solids in contact with liquid solder

被引：17

作者：

Mannan, S ^{[1
]}

Clode, MP ^{[1
]}

机构：

[1] Kings Coll London, Dept Mech Engn, London WC2R 2LS, England

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2004年 / 16卷 / 03期

关键词：

soldering; physical properties of materials;

D O I：

10.1108/09540910410562509

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The dissolution rate of a solid metal such as Cu, in contact with molten solder can be calculated with the use of the Nernst-Brenner equation. We describe how this equation should be correctly used in cases when the solder is in contact with both the base metal and any intermetallic compounds that have formed. We also show that the concentration of solute in the solder will generally lie between the metastable solubility limit and the equilibrium solubility limit, illustrating these ideas with reference to a system comprising Nb as the base metal and eutectic In-Sn as the solder, where the concentration levels can be directly correlated to the crystal growth rate.

引用

页码：31 / 33

页数：3

共 16 条

[11]

MANNAN SH, 2004, J ELECT MAT, V33

[12]

MANNAN SH, 2004, IEEE T ADV PACKAGING, V27

[13] A diffusion-kinetic model for predicting solder/conductor interactions in high density interconnections [J].

Rönkä, KJ ;

Van Loo, FJJ ;

Kivilahti, JK .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1998, 29 (12) :2951-2956

[14] Experiments on interaction of liquid tin with solid copper [J].

Snugovsky, L ;

Ruggiero, MA ;

Perovic, DD ;

Rutter, JW .

MATERIALS SCIENCE AND TECHNOLOGY, 2003, 19 (07) :866-874

[15] Interfacial reactions in molten Sn/Cu and molten In/Cu couples [J].

Su, LH ;

Yen, YW ;

Lin, CC ;

Chen, SW .

METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE, 1997, 28 (05) :927-934

[16] Mechanism of dissolution of sparingly soluble electrolytes [J].

Tang, RK ;

Nancollas, GH ;

Orme, CA .

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2001, 123 (23) :5437-5443

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