Advanced copper electroplating for application of electronics

被引：88

作者：

Miura, S

Honma, H

机构：

[1] Kanto Gakuin Univ, Fac Engn, Yokohama, Kanagawa 2368501, Japan

[2] Kanto Gakuin Univ, Grad Sch, Yokohama, Kanagawa 2368501, Japan

来源：

SURFACE & COATINGS TECHNOLOGY | 2003年 / 169卷

关键词：

copper electroplating; printed circuit boards; ultra large scale integration; via-filling; damascene process; additives;

D O I：

10.1016/S0257-8972(03)00165-8

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Copper electroplating has been of much interest for the interconnection of printed circuit boards (PCBs) and ultra large scale integration (ULSI), wiring so-called damascene process. Therefore, copper filling by electroplating has been actively studied. In this research, via-filling for build-up process of PCBs and the ULSI wiring formation without void and overplate has been examined using an acid cupric sulfate bath containing chloride (CO, polyethylene glycol, his (3-sulfopropyl) disulfidedisodium, Janus Green B and thiourea. The void-free filling in the range of 0.18-180 mum width via holes and trenches can be achieved by the selection of these additives. It is confirmed that the elements of these additives are detected only on the upper layer part of copper films by glow discharge optical emission spectroscopy. (C) 2003 Elsevier Science B.V. All rights reserved.

引用

页码：91 / 95

页数：5

共 12 条

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